Vapor chamber with spoiler structure

ABSTRACT

A vapor chamber includes an upper plate and a lower plate covering each other to form a hollow internal space, an evaporation portion and a condensation portion jointly formed by the upper plate and the lower plate, and a transmission portion communicating with the evaporation portion and the condensation portion. The transmission portion comprises multiple spoiler rods disposed therein to support between the lower plate and the upper plate. The spoiler rods at least include multiple first rods adjacent to an end of the evaporation portion and multiple second rods adjacent to an end of the condensation portion. A distance between any two of the first rods is less than a distance between any two of the second rods.

BACKGROUND Technical Field

The disclosure relates to a heat conduction component, particularly to avapor chamber with a spoiler structure.

Related Art

The related-art vapor chamber is used to attach on a heat source by onesurface, and another surface is used as a condenser to offer heatconduction and is designed with various shapes for matching differentdemands of heat dissipation. For example, by a design similar to a heatpipe, one part of a vapor chamber functions as a heated portion andanother part of a vapor chamber functions as a condenser, and thetransmission shapes in the middle are provided according to thedifferences of a heat source and a cooling position to constitutevarious types of vapor chambers to satisfy different demands of vaporchambers applied to various circumstances.

However, in practice, there may be some problems. For example, becauseof being subject of the variation required by the shape, the function orperformance of a vapor chamber may be affected. In general, a vaporchamber utilizes the gas-liquid phase change of the working fluid storedtherein to provide heat conduction. When liquid or gas working fluid istransmitting, the transmitting speed may be affected by the change ofshape of a vapor chamber. For example, when a cross-sectional area of avapor chamber is changed from large to small, the flow speed of thepassing working fluid is accelerated. When the evaporated working fluidis being accelerated, the returning working fluid is also affected thatmay cause dry-out because of no returning of working fluid. As a result,how to avoid such a problem is an important issue in the design of avapor chamber.

In view of this, the inventors have devoted themselves to theabove-mentioned prior art, researched intensively and cooperated withthe application of science to try to solve the above-mentioned problems.

SUMMARY

An object of the disclosure is to provide a vapor chamber with a spoilerstructure, which utilizes the additional spoiler structure to controlthe flow speed of working fluid in the vapor chamber to avoid thelimitations of functions or performance of heat conduction of the vaporchamber due to the demands of shape design.

To accomplish the above object, the disclosure provides a vapor chamberwith a spoiler structure, which includes an upper plate and a lowerplate covering each other to form a hollow internal space, anevaporation portion and a condensation portion jointly formed by theupper plate and the lower plate, and a transmission portioncommunicating with the evaporation portion and the condensation portion.The transmission portion includes multiple spoiler rods disposed thereinto support between the lower plate and the upper plate. The spoiler rodsat least include multiple first rods adjacent to an end of theevaporation portion and multiple second rods adjacent to an end of thecondensation portion. A distance between any two of the first rods isless than a distance between any two of the second rods.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded view of the first embodiment of the disclosure;

FIG. 2 is an assembled view of the first embodiment of the disclosure;

FIG. 3 is a plan schematic view of the first embodiment of thedisclosure;

FIG. 4 is a schematic view of the using status of the first embodimentof the disclosure;

FIG. 5 is a cross-sectional view according to line 5-5 in FIG. 4 ; and

FIG. 6 is a schematic view of the using status of the second embodimentof the disclosure.

DETAILED DESCRIPTION

The technical contents of this disclosure will become apparent with thedetailed description of embodiments accompanied with the illustration ofrelated drawings as follows. It is intended that the embodiments anddrawings disclosed herein are to be considered illustrative rather thanrestrictive.

Please refer to FIGS. 1-3 , which are an exploded view, an assembledview, and a plan schematic view of the first embodiment of thedisclosure. The disclosure provides a vapor chamber with a spoilerstructure. The vapor chamber 1 includes an upper plate 11 and a lowerplate 10 covering each other to form a hollow internal space. The lowerplate 10 is laid with a capillary layer 12. The capillary layer 12 maybe woven mesh, sintered metal powder or grooves formed in the lowerplate 10.

The upper plate 11 and the lower plate 10 of the vapor chamber 1 jointlyform an evaporation portion A and a condensation portion B. The lowerplate 10 has a lower evaporation portion 100 corresponding to theevaporation portion A and a lower condensation portion 101 correspondingto the condensation portion B. The upper plate 11 has an upperevaporation portion 110 corresponding to the evaporation portion A andan upper condensation portion 111 corresponding to the condensationportion B. The evaporation portion A may be greater than thecondensation portion B in area. A transmission portion C is disposedbetween the evaporation portion A and the condensation portion B forcommunicating with the evaporation portion A and the condensationportion B. The lower plate 10 has a lower transmission portion 102corresponding to the transmission portion C. The upper plate 11 has anupper transmission portion 112 corresponding to the transmission portionC. The transmission portion C is tapered from the evaporation portion Ato the condensation portion B to match the evaporation portion A withthe area greater than that of the condensation portion B.

As shown in FIG. 3 , the disclosure arranges a spoiler structure in thetransmission portion C to avoid acceleration of evaporated working fluidpassing the transmission portion C, which is tapered from theevaporation portion A to the condensation portion B. That may affect thereflow speed and the reflow amount to prevent dry-out. The inside of theof the transmission portion C is disposed with the spoiler structure.The spoiler structure is composed of multiple spoiler rods 13 supportingbetween the lower plate 10 and the upper plate 11. The spoiler rods 13at least include multiple first rods 130 adjacent to an end of theevaporation portion A and multiple second rods 131 adjacent to an end ofthe condensation portion B. A distance d between any two of the firstrods 130 is less than a distance D between any two of the second rods131. In addition, multiple third rods 132 may be disposed in thetransmission portion C and between the first rods 130 and the secondrods 131 and the multiple third rods 132 have transversal number changeadapted with tapered width (such that the third rods 132 along the widthdirection have substantially the same separation). The third rods 132may be arranged from the first rods 130 to the second rods 131 to beregularly distributed in the transmission portion C to maintain thespoiling effect.

Accordingly, as shown in FIG. 4 , the evaporation portion A may be usedon a heat source 2, and the condensation portion B may be disposed withmultiple fins 3 for heat dissipation. When the evaporation portion A isheated by the heat source 2, the evaporated working fluid in the vaporchamber 1 flows toward the condensation B. Because the distance dbetween the first rods 130 is the smallest in the spoiler structure, abetter spoiling effect may be provided to avoid acceleration of theevaporated working fluid. Next, as shown in FIG. 5 , the evaporatedworking fluid passing the transmission portion C is continuouslyaffected by the spoiler structure to gradually decelerate. When theevaporated working fluid finally passes the second rods 131, because thedistance D between the second rods 131 is the greatest in the spoilerstructure, the passed evaporated working fluid may smoothly enter thecondensation portion B for cooling. Meanwhile, because the working fluidreturning to liquid state in the condensation B reflows through thecapillary layer 12 in the lower plate 10 and the evaporated workingfluid in the transmission portion C may not accelerate due to thespoiler structure, the working fluid may rapidly reflow to theevaporation portion A through the capillary layer 12 with the capillaryforce to avoid dry-out.

Please refer to FIGS. 1 and 2 . In the disclosure, the inside of each ofthe upper evaporation portion 110 and the upper condensation portion 111of the evaporation portion A and the condensation portion B is disposedwith multiple support rods 14. The support rods 14 are also used tosupport between the lower plate 10 and the upper plate 11, and nodistance limitation therebetween because the spoiling issue may not needto be considered. The number of the support rods 14 may be adjusteddepending on the actual area sizes of the evaporation portion A and thecondensation portion B. Generally speaking, the support rods 14 are lessthan the spoiler rods 13 in the distribution density.

Thus, by the above structure, the vapor chamber with the spoilerstructure is obtained.

In addition, as shown in FIG. 6 , in the second embodiment of thedisclosure, the vapor chamber 1 may use the evaporation portion A withdifferent shapes to correspond to different or multiple heat sources 2.Meanwhile, the condensation portion B may be added depending on thecondensing positions. Also, one transmission portion C is disposedbetween each condensation portion B and the evaporation portion A. Theshape of the transmission portion C may be arranged depending on theactual positions of the heat source 2 and heat dissipation element. Inthe transmission portion C, the spoiler structure of the disclosure maybe implemented to reduce or avoid acceleration of evaporated workingfluid during transmitting and affect the reflow effect. That may preventdry-out, and the shape of the vapor chamber 1 may be changed dependingon actual demands of circumstances to match diverse demands of changesof circumstances.

While this disclosure has been described by means of specificembodiments, numerous modifications and variations could be made theretoby those skilled in the art without departing from the scope and spiritof this disclosure set forth in the claims.

What is claimed is:
 1. A vapor chamber with a spoiler structure, thevapor chamber comprising: an upper plate and a lower plate, coveringeach other to configure a hollow internal space; an evaporation portionand a condensation portion, jointly configured by the upper plate andthe lower plate; and a transmission portion, communicating with theevaporation portion and the condensation portion; wherein thetransmission portion comprises multiple spoiler rods disposed therein tosupport between the lower plate and the upper plate, the spoiler rods atleast comprise multiple first rods adjacent to an end of the evaporationportion and multiple second rods adjacent to an end of the condensationportion, and a distance between any two of the first rods is less than adistance between any two of the second rods.
 2. The vapor chamber ofclaim 1, wherein a capillary layer is laid inside the lower plate. 3.The vapor chamber of claim 2, wherein the capillary layer comprises awoven mesh, a sintered metal powder or multiple grooves disposed in thelower plate.
 4. The vapor chamber of claim 1, wherein the lower platecomprises a lower evaporation portion corresponding to the evaporationportion and a lower condensation portion corresponding to thecondensation portion, and the upper plate comprises an upper evaporationportion corresponding to the evaporation portion and an uppercondensation portion corresponding to the condensation portion.
 5. Thevapor chamber of claim 4, wherein an area of the evaporation portion isgreater than an area of the condensation portion.
 6. The vapor chamberof claim 1, wherein the lower plate comprises a lower transmissionportion corresponding to the transmission portion, the upper platecomprises an upper transmission portion corresponding to thetransmission portion, and the transmission portion is tapered from theevaporation portion to the condensation portion.
 7. The vapor chamber ofclaim 1, wherein multiple third rods are disposed in the transmissionportion and between the first rods and the second rods.
 8. The vaporchamber of claim 7, wherein the third rods are arranged between thefirst rods and the second rods to be regularly distributed in thetransmission portion.
 9. The vapor chamber of claim 1, wherein thecondensation portion is multiple in number.
 10. The vapor chamber ofclaim 9, wherein the condensation portions jointly communicate with theevaporation portion by the transmission portion respectively.